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Appendix B: Publicly-Available Bath Chemistry Data

B.1 Range of Bath Concentrations for the Electroless Copper Technology

B.2 Bath Concentrations for the Carbon Technology, Non-Conveyorized

B.3 Bath Concentrations for the Carbon Technology, Conveyorized

B.4 Product Concentrations for the Conductive Ink Technology

B.5 Bath Concentrations for the Conductive Polymer Technology

B.6 Range of Bath Concentrations for the Graphite Technology

B.7 Bath Concentrations for the Non-Formaldehyde Electroless Copper Technology

B.8 Bath Concentrations for the Organic-Palladium Technology

B.9 Range of Bath Concentrations for the Tin-Palladium Technology

Table B.1 Range of Bath Concentrations for the Electroless Copper Technology

Bath	Chemicalsa	Bath Concentration (g/l)
		Low	High	Average
Cleaner/Conditioner	Sulfuric Acid p-Toluene Sulfonic Acid Isopropyl Alcohol; 2-Propanol Hydroxyacetic Acid Potassium Hydroxide Ammonium Chloride Formic Acid Cationic Emulsifier Triethanolamine Phosphate Ester Ethylene Glycol Dimethylformamide Confidential Ingredients Ethanolamine	9.90 9.90 1.65 34.7 0.53 12.9 12.9 6.44 30.3 30.3 2.44 1.32 2.00 16.3	6.44	3.36
Micro-Etch	Potassium Peroxymonosulfate Potassium Bisulfate Potassium Sulfate Magnesium Carbonate Potassium Persulfate Sulfuric Acid Hydrogen Peroxide Sodium Hydroxide Copper Sulfate - Pentahydrate Ethylene Glycol	25.8 13.8 19.2 1.20 9.80 1.84 13.8 0.30 0.50 1.93	340 35.9	121 19.9
Predip	Sodium Bisulfate HCL Sulfuric Acid	2.58 31.7 2.58	46.6 182	24.6 85.6
Catalyst	Hydrochloric Acid Stannous Chloride as Tin (II) Palladium (Dissolved) Methanol Sodium Bisulfate Sodium Sulfate Sodium Hydroxide	1.98 6.32 0.36 2.52 45.2 12.6 2.53	158 16.6	50.9 10.3
Accelerator	Sodium Chlorite Sulfuric Acid Sodium Hypophosphite Fluoboric Acid	4.52 18.2 8.58 60.0	60.0	60.0
Electroless Copper	Formaldehyde Copper Chloride Copper Sulfate as Copper Hydrochloric Acid Sodium Hydroxide Ethylenediamine-Tetraacetic Acid    Tetrasodium Salt (EDTA) Methanol Potassium Cyanide Potassium-Sodium Tartrate Sodium Carbonate Tartaric Acid Sodium Cyanide Alkaline Mixture Sulfuric Acid	1.58 5.06 4.79 0.48 5.78 34.2 0.04 0.22 31.4 0.05 1.03 0.23 154 1.15	5.59 8.32 11.6 15.7 56.2 2.80	3.68 6.69 6.98 10.1 45.2 1.39
Acid Dip	Sulfuric Acid Dimethylaminoborane Boric Acid	NR 0.72 5.00
Anti-Tarnish	Methanol Sulfuric Acid Isopropyl Alcohol Potassium Hydroxide Benzotriazole 2-Ethoxyethanol Sodium m-Nitrobenzenesulfonate	0.95 28.8 2.02 0.30 0.12 45.9 0.12	1.25	1.10
Cleaner/Conditioner	Nonionic Surfactant Potassium Carbonate Monoethanolamine; 2-Aminoethanol Triethanolamine; 2,2'2"-Nitrilotris (Ethanol) 2-Propanol Surface Agent (non-haz)	4.50 6.16 14.2 5.1 2.04 15.3	25.4 25.4	19.8 15.2
Predip	Sodium Bisulfate Sodium Chloride Hydrochloric Acid	46.6 360 1.85	17.1	10.3
Catalyst	Sodium Bisulfate Sodium Chloride Hydrochloric Acid Tin(II) chloride, Stannous Chloride as Tin Palladium (Dissolved) Palladium Chloride Vanillin 1,3-Benzenediol	42.9 653 9.60 21.1 0.96 0.50 1.50 0.73	46.0 46.0 0.70	22.9 31.8 0.60
Accelerator	Fluoroboric Acid as Fluoride Copper as CU(II) Copper Sulfate Sulfuric Acid Sodium Hydroxide Potassium Carbonate Lithium Hydroxide Monoethanolamine	18.9 2.55 0.23 0.93 14.4 318 20.3 3.49	1.38 43.5 20.3	0.81 29.0 11.9
Micro-Etch	Copper Sulfate as Copper Sulfuric Acid Phosphoric Acid Hydrogen Peroxide Sodium Persulfate: Disodium Peroxydisulate	13.3 9.20 NR 17.5 135	35.0 175	20.9 151
Acid Dip	Sulfuric Acid	191

^a May not include trade secret chemicals or those materials identified as "non-hazardous materials" on the MSDSs.

 

Table B.2 Bath Concentrations for the Carbon Technology, Non-Conveyorized^a

Bath	Chemicalsb	Concentration in Bath
Cleaner	Monoethanolamine Ethylene Glycol	11.6 NR
Conditioner	Monoethanolamine	11.5
Carbon Black	Potassium Carbonate Potassium Hydroxide Sulfuric Acid Carbon Black	62.3 0.46 0.04 NR
Micro-Etch	Sodium Persulfate Sulfuric Acid Copper Sulfate Pentahydrate	200 1.84 5.0

^a The carbon technology was the only MHC technology listing different chemical concentrations depending on the equipment configuration (e.g., conveyorized or non-conveyorized.)
^b May not include trade secret chemicals or those materials identified as "non-hazardous materials" on the MSDSs.

 

Table B.3 Bath Concentrations for the Carbon Technology, Conveyorized^a

Bath	Chemicalsb	Concentration in Bath
Cleaner	Monoethanolamine Ethylene Glycol	12.7 NR
Conditioner	Monoethanolamine	34.5
Carbon Black	Potassium Hydroxide Carbon Black	20.4 NR
Micro-Etch	Sodium Persulfate Sulfuric Acid Copper Sulfate Pentahydrate	200 1.84 5.0

^a The carbon technology was the only MHC technology listing different chemical concentrations depending on the equipment configuration (e.g., conveyorized or non-conveyorized.)
^b May not include trade secret chemicals or those materials identified as "non-hazardous materials" on the MSDSs.

 

Table B.4 Product Concentrations for the Conductive Ink Technology

Bath		Chemicalsa	Constituent Concentration (weight %)
Micro-Etch	Conventional micro-etch cleaning processes may be used as well as light brushing
Screen Print Ink (5 different product formulations are listed)	Formulation A	Silver 2-Butoxyethanol Acetate Phenol-Formaldehyde Resin Trade Secret Resin* Methanol Isophorone Modifiers	60 - 80 15 - 25 5 - 10 1-5 < 5 1 - 2 < 1
	Formulation B	Additives & Modifiers Silver-Coated Copper Powder Phenol-Formaldehyde Co-Polymer Diethylene Glycol Monomethyl Ether	< 5 70 - 90 1 0 -20 < 10
	Formulation C	Additives & Modifiers Silver-Coated Copper Powder Phenol-Formaldehyde Co-Polymer Diethylene Glycol Monomethyl Ether	< 5 70 - 90 10-20 < 10
	Formulation D	Silver-Plated Copper Powder Phenol-Formaldehyde Polymer Diethylene Glycol Monomethyl Ether Modifiers	80- 90 10 - 20 5 - 15 < 3
	Formulation E	Phenol-Formaldehyde Resin Trade Secret Resin* Graphite Diethylene Glycol Butyl Ether Diethylene Glycol Ethyl Ether Carbon Black Butyl Cellosolve Acetate Methanol	20 - 30 25 - 35 10 - 20 10 - 20 < 10 5 - 10 5 - 10 < 5

^a May not include trade secret chemicals or those materials identified as "non-hazardous materials" on the MSDSs.

 

  Table B.5 Bath Concentrations for the Conductive Polymer Technology

Bath	Chemicals a	Bath Concentration (g/l)
Micro-Etch	Potassium Peroxymonosulfate Sulfuric Acid	100 20
Cleaner/Conditioner	Natrium Carbonate (Sodium Carbonate)	7.5
Catalyst	Phosphoric Acid Alkali Permanganate Sodium Hydroxide	2.75 815 0.9
Conductive Polymer	Phosphoric Acid Potassium Hydroxide in Azoles	26.8 3

^a May not include trade secret chemicals or those materials identified as "non-hazardous materials" on the MSDSs.

 

Table B.6 Range of Bath Concentrations for the Graphite Technology

Bath	Chemicalsa	Concentration in Bath (g/l)
		Low	High	Average
Cleaner/Conditioner	Non-Haz-Ingredients Surfactant Potassium Carbonate Ethanolamine	437 2.06 7.39 19.7
Graphite	Graphite Non-Haz-Ingredients Ammonia	29.8 127 1.95	61.2	45.5
Micro-Etch	Sulfuric Acid Sodium Persulfate Potassium Peroxymonosulfate Copper Sulfate as Copper Non-Haz Ingredients	28.0 23.5 30.1 2.67 15.6	90.3 90.3	59.1 56.9

^a May not include trade secret chemicals or those materials identified as "non-hazardous materials" on the MSDSs.

 

Table B.7 Bath Concentrations for the Non-Formaldehyde Electroless Copper Technology

Bath	Chemicalsa	Bath Concentration
Cleaner/Conditioner
Micro-Etch	Potassium Persulfate Sulfuric Acid Hydrogen Peroxide Sodium Hydroxide Copper Sulfate - Pentahydrate	9.80 20.2 16.1 0.30 0.50
Predip
Catalyst	Hydrochloric Acid Stannous Chloride	2.96 9.48
Postdip	Hydrochloric Acid	NR
Accelerator	Sodium Chlorite	4.52
Electroless Copper/Copper Flash	Copper Sulfate Sulfuric Acid Sodium Hydroxide	22.4 2.56 NR
Anti-Tarnish	Isophopyl Alcohol Potassium Hydroxide	2.02 0.30

^a May not include trade secret chemicals or those materials identified as "non-hazardous materials" on the MSDSs.

 

Table B.8 Bath Concentrations for the Organic-Palladium Technology^a

Bath	Chemicals	Concentration in Bath (g/l)
Conditioner	Trade Secret AQ Solution, Cationic Resin Sodium Carbonate Sodium Bicarbonate	5 NR 3 5
Micro-Etch	Sodium Persulfate Sodium Bisulfate	75 75
Predip	HCL Acid (25% pure)	3.12
Conductor	HCL Acid Trade Secret Sodium Hypophosphite-1Hydrate	3 3 3.06
Postdip	Sodium Carbonate Trisodium Citrate - 5.5 Hydrate Trade Secret	12.6 12.6 34.5

^a May not include trade secret chemicals or those materials identified as "non-hazardous materials" on the MSDSs.

 

  Table B.9 Range of Bath Concentrations for the Tin-Palladium Technology

Bath	Chemicalsa	Low	High	Average
Cleaner/Conditioner	Nonionic Surfactant Potassium Carbonate Monoethanolamine; 2-Aminoethanol Triethanolamine; 2,2',2"-Nitrilotris (ethanol) 2-Propanol Surface Agent (non-haz)	4.50 6.16 14.2 5.1 2.04 15.3	25.4 25.4	19.8 15.2
Predip	Sodium Bisulfate Sodium Chloride Hydrochloric Acid	46.6 360 1.85	17.10	10.3
Catalyst	Sodium Bisulfate Sodium Chloride Hydrochloric Acid Tin(II) Chloride, Stannous Chloride as Tin Palladium (dissolved) Palladium Chloride Vanillin 1,2-Benzenediol	42.9 653 9.60 21.1 0.96 0.50 1.50 0.73	46.0 46.0 0.70	22.9 31.8 0.60
Accelerator	Fluoroboric Acid as Fluoride Copper as Cu (II) Copper Sulfate Sulfuric Acid Sodium Hydroxide Potassium Carbonate Lithium Hydroxide Monoethanolamine	18.9 2.55 0.23 0.93 14.4 318 20.3 3.49	1.38 43.5 20.3	0.81 29.0 11.9
Micro-Etch	Copper Sulfate as Copper Sulfuric Acid Phosphoric Acid Hydrogen Peroxide Sodium Persulfate; Disodium Peroxydisulfate	13.3 9.20 NR 17.5 135	35.0 175	20.9 151
Acid Dip	Sulfuric Acid	191

^a May not include trade secret chemicals or those materials identified as "non-hazardous materials" on the MSDSs.

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