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Notes

a. Exchange rates play a major factor in analyzing the world market. Growth and market share depend on which currency is used to measure the markets and the current exchange rate. All world market data in this report are measured in U.S. dollars based upon the exchange rate as of 31 December 1993.

c. Pedersen, Pitts, et al., Electronics Industry Environmental Roadmap, MCC, 1994, p. 39.

c. Pedersen, Pitts, et al., Electronics Industry Environmental Roadmap, MCC, 1994, p. 39.

d. J. F. D'Amico and M.A. DeAngelo, J. Electrochemical Soc., Vol. 120, No. 11, 1973, p. 1469.

e. A. Iwaki et al., Photographic Science Engineering, Vol. 20, No. 6, 1976, p. 246.

f. D.F. Frisch, Electronic Packaging and Production, February 1985, pp. 194-203.

g. J.F. Mansfeld and J.M. Jans, Plating and Surface Finishing, Vol. 66, No. 1, 1979, p. 14.

h. K. Krubsack, Guide to the PWB Marketplace, Ed. by C. Lane & G. Mancuso, 1993, Chapter 37, pp. 37.1-37.3.

i. D. Carey, M. Breen, et al., "Low Cost Interconnect 1 Final Report," MCC Technical Report #HVE-161-92(Q), pp. 127-130.

j. San Diego, CA, Phone: (619) 546-3788.

k. D. Carey, M. Breen, et al., "Low Cost Interconnect 1 Final Report," MCC Technical Report #HVE-161-92(Q), pp. 23 and 127-130.

l. Direct Metallization - Overview, Technical Bulletin 9410, DuPont Electronic Materials.

m. P. Goldman, "The Economics of Replacing Electroless Copper," Circuitree, February 1994.

n. Direct Metallization - Overview, Technical Bulletin 9410, DuPont Electronic Materials.

o. Metcalf and Eddy, Wastewater Engineering: Treatment, Disposal, Reuse, 2nd Ed., McGraw-Hill series in water resources and environmental engineering, 1979, p. 102-104.

p. G. Pitts, R. Ferrone, et al., "Environmental Consciousness: A Strategic Competitiveness Issue for the Electronics and Computer Industry (Summary Report)," an Industry-led Study Sponsored in part by The U.S. Department of Energy and coordinated by The Microelectronics and Computer Technology Corporation (MCC), March 1993, p. 2.

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