Cleaning solvents are used to remove oil, grease, solder flux, and other contaminants. In the SNAP program, the “cleaning solvent” sector refers to substitutes for non-aerosol solvents used in industrial cleaning in vapor degreasing, cold batch cleaning, or automated cleaning equipment. SNAP does not currently cover dry cleaning, manual cleaning with non-aerosol solvents, non-aerosol mold release agents, or component testing agents. SNAP reviews alternatives for ozone-depleting cleaning solvents such as CFC-113 and methyl chloroform.
The SNAP program has reviewed and identified substitutes for three cleaning solvent end uses:
Metal cleaning is removing contaminants such as cutting oils, grease, or metal filings from metal parts.
Electronics cleaning is removing contaminants, primarily solder flux residues, from electronics or circuit boards.
Precision cleaning is cleaning to a specific grade of cleanliness in order for products to maintain their value.
You will need Adobe Reader to view some of the files on this page. See EPA's PDF page to learn more.
- Commonly asked questions about EPA's regulations on the appropriate use of nPB, such as how EPA is proposing that nPB may be used, exposure levels EPA considers potentially protective, and more.
- Development of Safer Cleaning Alternatives in the Aerospace, Printing, and Coating Industries (PDF, 60 pp., 3.8MB)
- This report by the Institute for Research and Technical Assistance describes successful, environmentally-friendly, cost-effective cleaners that can remove adhesives, coatings, and inks.
- The U.S. Solvent Cleaning Industry and the Transition to Non Ozone Depleting Alternatives (PDF, 73 pp., 563K)
- This report serves as an objective assessment of progress toward using alternatives to ozone depleting substances (ODS).
Vendors of Solvent Substitutes: