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Global Mitigation of Non-CO2 Greenhouse Gases

Global Mitigation of Non-CO2 Greenhouse Gases: Semiconductor Manufacturing

Key Points

  • Baseline emissions from semiconductor manufacturing are projected to increase slowly from 18 million metric tons of carbon dioxide equivalent (MtCO2e) in 2010 to 22 MtCO2e in 2030.
  • The global abatement potential ranges from 0.2 MtCO2e at today’s forecasted energy prices to the technological maximum potential of 4.2 MtCO2e.
  • 20% of the total abatement potential in this sector is achievable at costs at or below $30/tCO2e.

Sector Description

The semiconductor manufacturing industry uses several fluorinated greenhouse gases (F-GHGs), including sulfur hexafluoride (SF6), nitrogen trifluoride (NF3), and perfluorcarbons (PFCs) during fabrication. Trace amounts of these gases are incidentally released into the atmosphere through normal fabrication activities. In 2010, 18 MtCO2e of emissions were produced from the semiconductor manufacturing sector.

2030 emissions from semiconductor manufacturing are projected to be 22 million MtCO2e, or 0.2% of total non-CO2 emissions. Projected 2030 top 5 emitting countries are China, the US, Japan, Singapore & South Korea.View or download the full-size image here.(121 K, PNG)

Emissions Reduction Potential

Assuming full implementation of current technology, emissions in the semiconductor manufacturing sector could be reduced by up to 4 MtCO2e in 2030. This accounts for 0.09% of the 4,615 MtCO2e in global reduction potential in 2030.

Potential for fluorinated GHG reductions from semiconductor manufacturing: Full implementation of current technology could reduce emissions by up to 4 MtCO2e in 2030, or 0.09% of the 4,615 MtCO2e in global reduction potential for non-CO2 GHGs in 2030.View or download the full-size image here.(99 K, PNG)

Abatement Potential

Global F-GHG abatement potential in the semiconductor manufacturing industry is estimated to be 4.6 MtCO2e and 4.2 MtCO2e in 2020 and 2030, respectively, which correspond to 23% and 20% of business as usual (BAU) emissions from this sector. In 2030, the abatement potential of 1 MtCO2e, or 4%, is achievable at abatement costs below $30 per tCO2e.

2030 baseline projected global fluorinated greenhouse gas emissions from semiconductor manufacturing: It would be cost-effective to reduce emissions by 1% compared to the baseline. An additional 19% reduction is available with increasingly higher costs.It would be cost-effective to reduce emissions by 1%, compared to the baseline, in 2030. An additional 19% reduction is available using technologies with increasingly higher costs.

View or download the full-size image here.(38 K, PNG)

Abatement Measures

Despite rapid growth between 2000 and 2010, the semiconductor manufacturing industry experienced a stark decline in F-GHG emissions, decreasing from 28 MtCO2e in 2000 to 18 MtCO2e in 2010. This decline can be attributed to voluntary emissions reduction goals set by the World Semiconductor Council. Additionally, six abatement technologies were considered to further reduce emissions from this sector: thermal abatement systems, catalytic abatement systems, plasma abatement systems, NF3 remote chamber clean process, gas replacement, and process optimization.

2030 achievable reductions in semiconductor manufacturing fluorinated greenhouse gas emissions by technology: The solid bars show reductions achievable at a cost less than $0/tCO2e, and the fading bars show the reductions achievable at a higher prices.Emissions reductions by technology in 2030 at $0/tCO2e and at higher prices.

View or download the full-size image here.(40 K, PNG)

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