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Greenhouse Gas Reporting Program (GHGRP)

GHGRP Electronics Manufacturing

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computer iconThis source category includes, but is not limited to, facilities that manufacture semiconductors (including light-emitting diodes), micro-electromechanical systems (MEMS), liquid crystal displays (LCDs), and photovoltaic cells (PV). Specifically, this subsector consists of electronics manufacturing facilities with production processes that use plasma-generated fluorine atoms and other reactive fluorine-containing fragments to etch thin films, clean chambers for depositing thin films, clean wafers, or remove residual material. The source category also includes electronics manufacturing facilities with chemical vapor deposition processes or other production processes that use N2O, and with processes that use fluorinated GHGs as heat transfer fluids (HTF) to control temperature or clean surfaces.

Electronics Manufacturing — Greenhouse Gas Emissions Reported to the GHGRP
(all emissions values presented in million metric tons CO2e)
  2011 2012 2013 2014 2015 2016
Number of facilities: 56 56 58 59 58 53
Total emissions (CO2e): 7.0 6.4 5.2 6.2 6.3 6.2
Emissions by greenhouse gas (CO2e)
• Carbon dioxide (CO2): 1.6 1.5 0.7 0.7 0.8 0.7
• Methane (CH4): ** ** ** ** ** **
• Nitrous oxide (N2O): 0.2 0.2 0.2 0.2 0.2 0.2
• Hydrofluorocarbons (HFCs): 0.2 0.2 0.2 0.3 0.3 0.3
• Hydrofluoroethers (HFEs): ** ** ** ** ** **
• Perfluorocarbons (PFCs): 3.2 2.8 2.7 3.0 3.0 2.9
• Sulfur hexafluoride (SF6): 0.3 0.3 0.3 0.7 0.7 0.8
• Nitrogen trifluoride (NF3): 0.6 0.6 0.5 0.5 0.6 0.6
• Other Fully Fluorinated GHGs 0.7 0.8 0.6 0.8 0.7 0.6
• Very short-lived compounds ** ** ** ** ** **

Emissions of CO2 and CH4 are from stationary fuel combustion sources.

What factors influenced the trend in emissions for electronics manufacturing?

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